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(Referência obtida automaticamente do Web of Science, por meio da informação sobre o financiamento pela FAPESP e o número do processo correspondente, incluída na publicação pelos autores.)

Dendritic Growth, Eutectic Features and Their Effects on Hardness of a Ternary Sn-Zn-Cu Solder Alloy

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Autor(es):
Silva, Bismarck Luiz ; Reyes, Rodrigo Valenzuela ; Garcia, Amauri ; Spinelli, Jose Eduardo
Número total de Autores: 4
Tipo de documento: Artigo Científico
Fonte: ACTA METALLURGICA SINICA-ENGLISH LETTERS; v. 30, n. 6, p. 528-540, JUN 2017.
Citações Web of Science: 3
Resumo

The present investigation is based on the results of a directionally solidified (DS) Sn-9 wt% Zn-2 wt% Cu alloy, including primary/secondary/tertiary dendrite arm spacings of the Sn-rich matrix, the morphologies of the eutectic mixture and the corresponding interphase spacing, the nature and proportion of the Cu-Zn intermetallic compound (IMC). The main purpose is to establish interrelations of these microstructure features with experimental solidification thermal parameters, such as cooling rates and growth rates (v), macrosegregation and hardness. Such interrelations are interesting for both industry and academy since they represent a tool permitting the preprogramming of final properties based on the design of the microstructure. In the case of Sn-Zn-Cu alloys, hardly anything is known about the combined effects of the length scale of the microstructure and fraction and distribution of the primary IMC on hardness. The alloy microstructure is composed of a beta-Sn dendritic region, surrounded by a eutectic mixture of alpha-Zn and beta-Sn phases and the gamma-Cu5Zn8 IMC. The eutectic interphase spacing varies in the range 1.2-3.6 mu m, with the alpha-Zn phase having a globular morphology for v > 0.5 mm/s and a needle-like morphology for v < 0.3 mm/s. A modified Hall-Petch-type experimental expression relating hardness to the interphase spacing is proposed. (AU)

Processo FAPESP: 15/11863-5 - Parâmetros da microestrutura de solidificação de ligas multicomponentes Al-Si-Cu, Sn-Bi-Sb e Zn-Sn-Cu e propriedades mecânicas decorrentes
Beneficiário:José Eduardo Spinelli
Linha de fomento: Auxílio à Pesquisa - Regular
Processo FAPESP: 13/08259-3 - Desenvolvimento microestrutural e do comportamento mecânico de ligas alternativas de soldagem Sn-Bi-Cu e Sn-Bi-Ag
Beneficiário:Bismarck Luiz Silva
Linha de fomento: Bolsas no Brasil - Doutorado