Transient Unidirectional Solidification, Microstructure and Intermetallics in Sn-Ni Alloys

Autor(es)

da Cruz, Clarissa Barros ^[1] ; Kakitani, Rafael ^[1] ; Cavalcante Xavier, Marcella Gaute ^[2] ; Silva, Bismarck Luiz ^[3] ; Garcia, Amauri ^[1] ; Cheung, Noe ^[1] ; Spinelli, Jose Eduardo ^[2]

Afiliação do(s) autor(es)

^[1] Univ Estadual Campinas, UNICAMP, Dept Engn Mat & Manufatura, BR-13083860 Campinas, SP - Brazil

^[2] Univ Fed Sao Carlos UFSCar, Dept Engn Mat, BR-13565905 Sao Carlos, SP - Brazil

^[3] Univ Fed Rio Grande do Norte UFRN, Dept Engn Mat, BR-59078970 Natal, RN - Brazil

• Tipo de documento: Artigo Científico
• Fonte: MATERIALS RESEARCH-IBERO-AMERICAN JOURNAL OF MATERIALS; v. 21, n. 1 2018.
• Citações Web of Science: 1

Resumo

The present research work examines the microstructural arrangements formed during the transient solidification of eutectic Sn-0.2wt.%Ni and hypereutectic Sn-0.5wt.%Ni alloys. Also, it examines their respective correlations with solidification thermal parameters: eutectic growth rate (V-E) and eutectic cooling rate (<(T)over dot>(E)); length scales of matrix and eutectic phases: microstructural spacings and the corresponding tensile properties: ductility and strength. Both alloys were directionally solidified upwards under unsteady-state regime, and characterized by optical and scanning electron microscopy. Concerning the hypereutectic Sn-0.5wt.%Ni, the increase in Ni content is shown to influence both thermal behavior and cellular spacing (lambda(C)). The NiSn4 intermetallics is present in the eutectic mixture of both alloys, whilst in the Sn-0.5wt.%Ni alloy the primary phase has been identified by SEM-EDS as the Ni3Sn4 intermetallics. A beta-Sn morphological cellular/dendritic transition occurs in the 0.2wt.%Ni eutectic alloy for <(T)over dot>(E)> 1.2K/s. Despite that, regular cells in the hypereutectic alloy (0.5wt.%Ni) turns into plate-like cells for <(T)over dot>(E)> 1.4K/s. If considered a reference cellular spacing about 20 mu m (i.e., lambda(-1/2)(c)=0.22), the samples associated with the Sn-0.5wt.%Ni alloy are shown to be associated with higher tensile strengths, but much lower ductility as compared with the corresponding results of the eutectic alloy. (AU)

• Processo FAPESP: 17/15158-0 - Caracterização microestrutural e de propriedades na avaliação de ligas para contato térmico interfacial
• Beneficiário: Amauri Garcia
• Modalidade de apoio: Auxílio à Pesquisa - Regular
• Processo FAPESP: 16/18186-1 - Evolução microestrutural e resistências mecânica e ao desgaste de ligas ternárias Al-Bi-Si e Al-Bi-Ni solidificadas unidirecionalmente
• Beneficiário: José Marcelino da Silva Dias Filho
• Modalidade de apoio: Bolsas no Brasil - Pós-Doutorado
• Processo FAPESP: 17/12741-6 - Aplicação de técnicas experimentais de solidificação, caracterização microestrutural e de propriedades na avaliação de ligas eutéticas e hipereutéticas à base de Al e Zn
• Beneficiário: José Eduardo Spinelli
• Modalidade de apoio: Auxílio à Pesquisa - Regular
• Processo FAPESP: 15/11863-5 - Parâmetros da microestrutura de solidificação de ligas multicomponentes Al-Si-Cu, Sn-Bi-Sb e Zn-Sn-Cu e propriedades mecânicas decorrentes
• Beneficiário: José Eduardo Spinelli
• Modalidade de apoio: Auxílio à Pesquisa - Regular