| Texto completo | |
| Autor(es): |
Jarschel, Paulo Felipe
[1]
;
Souza, Mario C. M. M.
[1]
;
Merlo, Rafael Borges
[1]
;
Frateschi, Newton C.
[1]
Número total de Autores: 4
|
| Afiliação do(s) autor(es): | [1] Univ Estadual Campinas, Gleb Wataghin Phys Inst, Appl Phys Dept, UNICAMP, Device Res Lab, BR-13083859 Campinas, SP - Brazil
Número total de Afiliações: 1
|
| Tipo de documento: | Artigo Científico |
| Fonte: | IEEE Photonics Journal; v. 10, n. 4 AUG 2018. |
| Citações Web of Science: | 0 |
| Resumo | |
We propose and demonstrate a method to compensate insertion losses in Si photonics devices based on ring resonators fabricated in SOI foundries, with no additional chip area used. It consists in the employment of Er:Al2O3 as the upper cladding layer on standard Si/SiO2 rings, requiring only one simple post-processing step. The method is modeled in detail, and simulation results for single-ring configurations and photonic molecules are discussed, where the potential for loss reduction is predicted for different design choices based on the quality factor. We experimentally verify the viability of the method, obtaining an output power increase of 1 dB when a single-ring resonator is pumped. This value is increased when the method is applied to devices based on photonic molecules, where a value of 2.6 dB has been measured. This is equivalent to a loss reduction potential higher than 3 dB for a photonic molecule designed to achieve a quality factor of 50000. (AU) | |
| Processo FAPESP: | 08/57857-2 - Fotônica para comunicações ópticas |
| Beneficiário: | Hugo Luis Fragnito |
| Modalidade de apoio: | Auxílio à Pesquisa - Temático |
| Processo FAPESP: | 14/04748-2 - Microcavidades acopladas aplicadas ao processamento de sinais e integração fotônica |
| Beneficiário: | Mário César Mendes Machado de Souza |
| Modalidade de apoio: | Bolsas no Brasil - Doutorado |