Preparation and characterization of antistatic packaging for electronic components based on poly(lactic acid)/carbon black composites

Autor(es)

da Silva, Thais Ferreira ^[1] ; Menezes, Fernanda ^[1] ; Montagna, Larissa Stieven ^[1] ; Lemes, Ana Paula ^[1] ; Passador, Fabio Roberto ^[1]

Afiliação do(s) autor(es)

^[1] Univ Fed Sao Paulo UNIFESP, Polymer & Biopolymer Technol Lab TecPBio, Talim 330, BR-12231280 Sao Jose Dos Campos, SP - Brazil

• Tipo de documento: Artigo Científico
• Fonte: Journal of Applied Polymer Science; v. 136, n. 13 APR 5 2019.
• Citações Web of Science: 3

Resumo

Poly(lactic acid) (PLA) is a biodegradable aliphatic polymer obtained from renewable sources; its main application is in the packaging sector. Electronic components require the use of antistatic packaging that prevents damage and electric shock. As PLA has no conductive characteristics, it requires the addition of allotropic carbon forms such as conductive carbon black to make the polymer less resistive as the dissipative material and making it suitable for the manufacture of antistatic packaging. In this study, PLA was melt blended with 5, 10, and 15 wt % of carbon black. The composites were prepared using a high-speed mixer. Samples were characterized by Izod impact resistance tests, scanning electron microscopy, thermal properties, electrical characterization, and biodegradation tests in garden soil. The addition of carbon black in the PLA matrix increases the temperature of degradation and decreases the crystallinity degree and the impact resistance of the composites. However, carbon black is a great option to increase the electrical conductivity of PLA. The addition of carbon black in PLA makes the composite less resistive and suitable for use as antistatic packaging for the transportation and storage of electronic components. Furthermore, this composite does not cause damage to the environment as the carbon black does not interfere in the degradation mechanism of PLA. (c) 2018 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019, 136, 47273. (AU)

• Processo FAPESP: 16/19978-9 - Desenvolvimento de nanocompósitos de blendas de PA6/LLDPE e negro de fumo para embalagens antiestáticas para componentes eletrônicos
• Beneficiário: Fabio Roberto Passador
• Linha de fomento: Auxílio à Pesquisa - Regular
• Processo FAPESP: 14/04900-9 - Desenvolvimento de nanocompósitos de blendas de UHMW-PE/LLDPE e nanotubos de carbono para aplicações de alto impacto
• Beneficiário: Fabio Roberto Passador
• Linha de fomento: Auxílio à Pesquisa - Regular