Effects of Ag addition on phase transitions, microstructures and solder/copper interfaces of Sn99.1-xCu0.9Agx alloys

Autor(es)

Silva, L. S. ^[1] ; Souza, J. S. ^[1] ; Silva, R. A. G. ^[1]

Afiliação do(s) autor(es)

^[1] Univ Fed Sa Paulo UNIFESP, Dept Quim, Inst Ciencias Ambientais Quim & Farmaceut, Diadema, SP - Brazil

• Tipo de documento: Artigo Científico
• Fonte: JOURNAL OF THERMAL ANALYSIS AND CALORIMETRY; v. 136, n. 6, p. 2205-2210, JUN 2019.
• Citações Web of Science: 2

Resumo

In this work, the effects of Ag addition on phase transitions, microstructure and solder/copper interfaces of Sn99.1-xCu0.9Agx alloys were studied using differential scanning calorimetry, X-ray diffractometry, electron scanning microscopy and energy-dispersive X-ray spectroscopy. The results showed that the addition of Ag to the Sn99.1Cu0.9 alloy changes the thermal behavior of the melting and solidification points of studied alloys. The presence of silver also induced the formation of the Ag3Sn phase and decreased the amount of the Cu6Sn5 compound. (AU)

• Processo FAPESP: 12/50570-5 - Efeito da variação do teor de Al nas propriedades de ligas do sistema Cu-Al-Mn-Ag
• Beneficiário: Ricardo Alexandre Galdino da Silva
• Modalidade de apoio: Auxílio à Pesquisa - Regular