Effects of Ag addition on phase transitions, microstructures and solder/copper interfaces of Sn99.1-xCu0.9Agx alloys

Silva, L. S.; Souza, J. S.; Silva, R. A. G.

Advanced search

Search - Use quotation marks to get a more specific result

Index

Field of knowledge

Start date

Betweenand

(Reference retrieved automatically from Web of Science through information on FAPESP grant and its corresponding number as mentioned in the publication by the authors.)

Effects of Ag addition on phase transitions, microstructures and solder/copper interfaces of Sn99.1-xCu0.9Agx alloys

Full text
Author(s):	Silva, L. S. ^[1] ; Souza, J. S. ^[1] ; Silva, R. A. G. ^[1] Total Authors: 3
Affiliation:	^[1] Univ Fed Sa Paulo UNIFESP, Dept Quim, Inst Ciencias Ambientais Quim & Farmaceut, Diadema, SP - Brazil Total Affiliations: 1
Document type:	Journal article
Source:	JOURNAL OF THERMAL ANALYSIS AND CALORIMETRY; v. 136, n. 6, p. 2205-2210, JUN 2019.
Web of Science Citations:	2
Abstract
In this work, the effects of Ag addition on phase transitions, microstructure and solder/copper interfaces of Sn99.1-xCu0.9Agx alloys were studied using differential scanning calorimetry, X-ray diffractometry, electron scanning microscopy and energy-dispersive X-ray spectroscopy. The results showed that the addition of Ag to the Sn99.1Cu0.9 alloy changes the thermal behavior of the melting and solidification points of studied alloys. The presence of silver also induced the formation of the Ag3Sn phase and decreased the amount of the Cu6Sn5 compound. (AU)

Short URL