Interfacial heat transfer and microstructural analyses of a Bi-5% Sb lead-free alloy solidified against Cu, Ni and low-C steel substrates

Autor(es)

Soares, Thiago ^[1] ; Cruz, Clarissa ^[2] ; Xavier, Marcella ^[3] ; Reyes, V, Rodrigo ; Bertelli, Felipe ^[4] ; Garcia, Amauri ^[5] ; Spinelli, Jose E. ^[6] ; Cheung, Noe ^[5]

Afiliação do(s) autor(es)

^[1] Paulista Univ UNIP, Campus Manaus, BR-69050030 Manaus, Amazonas - Brazil

^[2] Fed Univ Ouro Preto UFOP, Inst Exact & Appl Sci, Dept Prod Engn, BR-35931008 Joao Monlevade, MG - Brazil

^[3] V, Fed Univ Sao Carlos UFSCar, Grad Program Mat Sci & Engn, BR-13565905 Sao Carlos, SP - Brazil

^[4] Fed Univ Sao Paulo UNIFESP, Marine Sci Inst, BR-11070100 Santos, SP - Brazil

^[5] Univ Estadual Campinas, UNICAMP, Dept Mfg & Mat Engn, BR-13083860 Campinas, SP - Brazil

^[6] Fed Univ Sao Carlos UFSCar, Dept Mat Engn, BR-13565905 Sao Carlos, SP - Brazil

• Tipo de documento: Artigo Científico
• Fonte: Journal of Alloys and Compounds; v. 860, APR 15 2021.
• Citações Web of Science: 0

Resumo

Bi-Sb system alloys demonstrate high corrosion resistance and good wettability, becoming promising for use as lead-free solder alloys. The simplicity of the phase diagram is also a characteristic of this system, which is isomorphous forming the (Bi,Sb) phase. While extensive research has been performed on heat flow in couples of microelectronics surfaces with eutectic and peritectic alloys, literature regarding the issues of interfacial heat transfer between isomorphous alloys and microelectronics substrates is nonexistent. In this regard, the present research work demonstrates not only the application of a numerical mathematical model for thermal interface conductance but also wetting and interfacial reaction layer results in the formation of phases for the Bi- 5 wt% Sb alloy in different substrate materials. After carrying out the mentioned analyzes in three different conditions, Bi-Sb/copper, Bi-Sb/nickel and Bi-Sb/low-C steel, the wetting angle is shown not to be the predominant factor in controlling the interfacial heat transfer. Instead, the phases forming the interfacial layer from each of the tested substrates have a role in the heat transfer coefficients (h). In the case of the steel substrate, there is no layer formation, which allows greater contact conductance, whereas Bi-Sb/copper and Bi-Sb/nickel couples generate smaller h, being reasonably similar to each other. (C) 2020 Elsevier B.V. All rights reserved. (AU)

• Processo FAPESP: 19/23673-7 - Avaliação de ligas para juntas térmicas e para manufatura aditiva
• Beneficiário: José Eduardo Spinelli
• Modalidade de apoio: Auxílio à Pesquisa - Regular
• Processo FAPESP: 17/15158-0 - Caracterização microestrutural e de propriedades na avaliação de ligas para contato térmico interfacial
• Beneficiário: Amauri Garcia
• Modalidade de apoio: Auxílio à Pesquisa - Regular