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(Reference retrieved automatically from Web of Science through information on FAPESP grant and its corresponding number as mentioned in the publication by the authors.)

Interfacial heat transfer and microstructural analyses of a Bi-5% Sb lead-free alloy solidified against Cu, Ni and low-C steel substrates

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Author(s):
Soares, Thiago [1] ; Cruz, Clarissa [2] ; Xavier, Marcella [3] ; Reyes, V, Rodrigo ; Bertelli, Felipe [4] ; Garcia, Amauri [5] ; Spinelli, Jose E. [6] ; Cheung, Noe [5]
Total Authors: 8
Affiliation:
[1] Paulista Univ UNIP, Campus Manaus, BR-69050030 Manaus, Amazonas - Brazil
[2] Fed Univ Ouro Preto UFOP, Inst Exact & Appl Sci, Dept Prod Engn, BR-35931008 Joao Monlevade, MG - Brazil
[3] V, Fed Univ Sao Carlos UFSCar, Grad Program Mat Sci & Engn, BR-13565905 Sao Carlos, SP - Brazil
[4] Fed Univ Sao Paulo UNIFESP, Marine Sci Inst, BR-11070100 Santos, SP - Brazil
[5] Univ Estadual Campinas, UNICAMP, Dept Mfg & Mat Engn, BR-13083860 Campinas, SP - Brazil
[6] Fed Univ Sao Carlos UFSCar, Dept Mat Engn, BR-13565905 Sao Carlos, SP - Brazil
Total Affiliations: 6
Document type: Journal article
Source: Journal of Alloys and Compounds; v. 860, APR 15 2021.
Web of Science Citations: 0
Abstract

Bi-Sb system alloys demonstrate high corrosion resistance and good wettability, becoming promising for use as lead-free solder alloys. The simplicity of the phase diagram is also a characteristic of this system, which is isomorphous forming the (Bi,Sb) phase. While extensive research has been performed on heat flow in couples of microelectronics surfaces with eutectic and peritectic alloys, literature regarding the issues of interfacial heat transfer between isomorphous alloys and microelectronics substrates is nonexistent. In this regard, the present research work demonstrates not only the application of a numerical mathematical model for thermal interface conductance but also wetting and interfacial reaction layer results in the formation of phases for the Bi- 5 wt% Sb alloy in different substrate materials. After carrying out the mentioned analyzes in three different conditions, Bi-Sb/copper, Bi-Sb/nickel and Bi-Sb/low-C steel, the wetting angle is shown not to be the predominant factor in controlling the interfacial heat transfer. Instead, the phases forming the interfacial layer from each of the tested substrates have a role in the heat transfer coefficients (h). In the case of the steel substrate, there is no layer formation, which allows greater contact conductance, whereas Bi-Sb/copper and Bi-Sb/nickel couples generate smaller h, being reasonably similar to each other. (C) 2020 Elsevier B.V. All rights reserved. (AU)

FAPESP's process: 19/23673-7 - Evaluation of alloys for thermal interface contact and for additive manufacturing
Grantee:José Eduardo Spinelli
Support Opportunities: Regular Research Grants
FAPESP's process: 17/15158-0 - Characterization of microstructure and properties in the evaluation of alloys for thermal interface contact
Grantee:Amauri Garcia
Support Opportunities: Regular Research Grants