The electrodeposition of Ni-Cu and Ni-Cu-P from aspartate-based baths

Autor(es)

Brito, Matheus M. ^[1] ; Artisiani, Raul A. ^[1] ; Carlos, Ivani A. ^[1]

Afiliação do(s) autor(es)

^[1] Univ Fed Sao Carlos, Dept Chem, CP 676, BR-13565905 Sao Carlos, SP - Brazil

• Tipo de documento: Artigo Científico
• Fonte: Journal of Alloys and Compounds; v. 890, JAN 15 2021.
• Citações Web of Science: 0

Resumo

The electrodeposition of Ni-Cu and Ni-Cu-P was performed over steel electrodes using baths containing aspartate as a complexing agent for the metallic cations. Through the rotating disk electrode technique and the measurement of the deposition potentials, it was found that the electrodeposition is controlled by activation at current densities (jdep) equal or lower than 10 mA cm-2 and suffers limitations on diffusion for jdep> 10 mA cm-2. The hydrogen evolution reaction during the electrodeposition was more intense over Ni-Cu-P films leading to a lower efficiency compared to the Ni-Cu films. The composition of the amount of Cu in the Ni-Cu films varied from 13.7% to 21.5%, while the amount of Cu in the Ni-Cu-P films varied from 24.4% to 43.1%. The P incorporation was low, varying from 1.2% to 2.8%. For the Ni-Cu films, globular, dendritic, and smooth films were obtained depending on the deposition control and the efficiency. The Ni-Cu-P presented dendritic and smooth morphology depending on the efficiency. (c) 2021 Elsevier B.V. All rights reserved. (AU)

• Processo FAPESP: 17/18389-2 - Desenvolvimento de banhos contendo ácido aspártico para eletrodeposição de ligas Ni-Cu e Ni-Cu-P e investigação do processo de eletrodeposição destas ligas: caracterização dos banhos e dos eletrodepósitos
• Beneficiário: Matheus Macedo de Brito
• Modalidade de apoio: Bolsas no Brasil - Doutorado Direto