Comparative study between wet and dry etching of silicon for microchannels fabrication

Autor(es)

Cirino, G. A. ; Barea, L. A. M. ; Mansano, R. D. ; Verdonck, P. ; von Zuben, A. ; Frateschi, N. C. ; Diniz, J. A. ; VonFreymann, G ; Schoenfeld, WV ; Rumpf, RC

• Tipo de documento: Artigo Científico
• Fonte: ADVANCED FABRICATION TECHNOLOGIES FOR MICRO/NANO OPTICS AND PHOTONICS XII; v. 10930, p. 5-pg., 2019-01-01.

Resumo

In this work we present a comparative study of two processes for the fabrication of an array of microchannels for microfluidics applications, based on integrated-circuit technology process steps, such as lithography and dry etching. Two different methods were investigated in order to study the resulting microstructures: wet and dry deep etching of silicon substrate. The typical etching depth necessary to the target application is 50 mu m. (AU)

• Processo FAPESP: 16/09509-1 - Processos de transferência de calor com mudança de fase de elevado desempenho aplicados ao aproveitamento de energia solar
• Beneficiário: Gherhardt Ribatski
• Modalidade de apoio: Auxílio à Pesquisa - Temático