Voltammetric study of the influence of benzotriazole on copper deposition from a sulphuric plating bath

Autor(es)

de Moraes, A. C. M. ^[1] ; Siqueira, J. L. P. ^[1] ; Barbosa, L. L. ^[1] ; Carlos, I. A. ^[1]

Afiliação do(s) autor(es)

^[1] Univ Fed Sao Carlos, Dept Quim, BR-13565905 Sao Carlos, SP - Brazil

• Tipo de documento: Artigo Científico
• Fonte: Journal of Applied Electrochemistry; v. 39, n. 3, p. 369-375, MAR 2009.
• Citações Web of Science: 2

Resumo

Copper electrodeposition on to a platinum substrate from an acid sulphate plating bath was investigated with and without the additive benzotriazole (BTAH). In voltammetric experiments, the deposition process is shifted to more negative potentials in the presence of BTAH than in its absence from the bath. Moreover, the current density of the deposition process was higher in the presence of this additive than in its absence. With or without the additive, copper deposition showed features of nucleation in the voltammetric curves. Scanning electronic microscopy (SEM) images showed that copper deposits laid down in the presence of BTAH, for any potential and charge density studied, were smoother than in the absence of this additive. X-ray spectra indicated that the electrodeposits produced in the absence or presence of BTAH were composed of a mixture of copper, copper oxide and platinum oxide and also indicated that in the presence of BTAH, the deposit was less crystalline than in its absence. (AU)

• Processo FAPESP: 06/51249-5 - Estudo e desenvolvimento de banho contendo EDTA para a eletrodeposição da liga Fe-Mo: caracterização física, química e morfológica do filme
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• Modalidade de apoio: Bolsas no Brasil - Iniciação Científica
• Processo FAPESP: 04/14142-2 - Estudo eletroanalítico de banhos de eletrodeposição de ligas prata-cobre e prata-zinco e caracterização morfológica, química e estrutural dos filmes
• Beneficiário: Ivani Aparecida Carlos
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