Sn-0.7 wt%Cu-(xNi) alloys: Microstructure-mechanical properties correlations with solder/substrate interfacial heat transfer coefficient

Autor(es)

Silva, Bismarck Luiz ^[1] ; Cheung, Noe ^[2] ; Garcia, Amauri ^[2] ; Spinelli, Jose Eduardo ^[1]

Afiliação do(s) autor(es)

^[1] Univ Fed Sao Carlos, Dept Mat Engn, BR-13565905 Sao Carlos, SP - Brazil

^[2] Univ Estadual Campinas, Dept Mfg & Mat Engn, BR-13083970 Campinas, SP - Brazil

• Tipo de documento: Artigo Científico
• Fonte: Journal of Alloys and Compounds; v. 632, p. 274-285, MAY 25 2015.
• Citações Web of Science: 19

Resumo

In spite of being barely studied, the prediction of mechanical properties by controlling and monitoring solidification thermal parameters (growth rate - v; cooling rate - (T) over dot; solder/substrate interfacial heat transfer coefficient - h(i)) may be a powerful tool in the pre-programming of optimized final properties in solder alloys. The management of these parameters is fundamental to determine the final as-soldered microstructure, including the morphologies and sizes of phases. Within this scope, the aim of the present investigation is to determine interrelations of thermal parameters (v, (T) over dot, h(i)), microstructure and tensile properties for Sn-0.7 wt%Cu-xNi (0-0.1 wt%Ni) solders solidified under steady-state conditions against a copper water-cooled substrate. It is demonstrated that the ultimate tensile strength can be linearly correlated with h(i) for Sn-Cu-Ni alloys. The final microstructures are shown to be very responsive to the changes in v as well as in Cu and Ni contents. (C) 2015 Elsevier B.V. All rights reserved. (AU)

• Processo FAPESP: 13/13030-5 - Microestrutura, parâmetros térmicos, segregação e propriedades mecânicas de ligas alternativas de soldagem à base de Sn, Zn e Bi
• Beneficiário: José Eduardo Spinelli
• Linha de fomento: Auxílio à Pesquisa - Regular
• Processo FAPESP: 13/08259-3 - Desenvolvimento microestrutural e do comportamento mecânico de ligas alternativas de soldagem Sn-Bi-Cu e Sn-Bi-Ag
• Beneficiário: Bismarck Luiz Silva
• Linha de fomento: Bolsas no Brasil - Doutorado