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(Reference retrieved automatically from Web of Science through information on FAPESP grant and its corresponding number as mentioned in the publication by the authors.)

Sn-0.7 wt%Cu-(xNi) alloys: Microstructure-mechanical properties correlations with solder/substrate interfacial heat transfer coefficient

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Author(s):
Silva, Bismarck Luiz [1] ; Cheung, Noe [2] ; Garcia, Amauri [2] ; Spinelli, Jose Eduardo [1]
Total Authors: 4
Affiliation:
[1] Univ Fed Sao Carlos, Dept Mat Engn, BR-13565905 Sao Carlos, SP - Brazil
[2] Univ Estadual Campinas, Dept Mfg & Mat Engn, BR-13083970 Campinas, SP - Brazil
Total Affiliations: 2
Document type: Journal article
Source: Journal of Alloys and Compounds; v. 632, p. 274-285, MAY 25 2015.
Web of Science Citations: 19
Abstract

In spite of being barely studied, the prediction of mechanical properties by controlling and monitoring solidification thermal parameters (growth rate - v; cooling rate - (T) over dot; solder/substrate interfacial heat transfer coefficient - h(i)) may be a powerful tool in the pre-programming of optimized final properties in solder alloys. The management of these parameters is fundamental to determine the final as-soldered microstructure, including the morphologies and sizes of phases. Within this scope, the aim of the present investigation is to determine interrelations of thermal parameters (v, (T) over dot, h(i)), microstructure and tensile properties for Sn-0.7 wt%Cu-xNi (0-0.1 wt%Ni) solders solidified under steady-state conditions against a copper water-cooled substrate. It is demonstrated that the ultimate tensile strength can be linearly correlated with h(i) for Sn-Cu-Ni alloys. The final microstructures are shown to be very responsive to the changes in v as well as in Cu and Ni contents. (C) 2015 Elsevier B.V. All rights reserved. (AU)

FAPESP's process: 13/13030-5 - Microstructure, thermal parameters, segregation and mechanical properties of lead-free Sn-based, Zn-based and Bi-based solder alloys
Grantee:José Eduardo Spinelli
Support Opportunities: Regular Research Grants
FAPESP's process: 13/08259-3 - Microstructure and mechanical behavior of Sn-Bi-Cu and Sn-Bi-Ag lead-free solder alloys
Grantee:Bismarck Luiz Silva
Support Opportunities: Scholarships in Brazil - Doctorate