Sacrificial adhesive bonding: a powerful method for fabrication of glass microchips

Autor(es)

Lima, Renato S. ^{[1, 2]} ; Leao, Paulo A. G. C. ^{[3, 4]} ; Piazzetta, Maria H. O. ^[2] ; Monteiro, Alessandra M. ^{[3, 4]} ; Shiroma, Leandro Y. ^{[1, 2]} ; Gobbi, Angelo L. ^[2] ; Carrilho, Emanuel ^{[3, 4]}

Afiliação do(s) autor(es)

^[1] Univ Estadual Campinas, Inst Quim, BR-13083970 Sao Paulo - Brazil

^[2] Ctr Nacl Pesquisa Energia & Mat, Lab Microfabricacao, Lab Nacl Nanotecnol, BR-13083970 Sao Paulo - Brazil

^[3] Univ Sao Paulo, Inst Quim Sao Carlos, BR-13566590 Sao Paulo - Brazil

^[4] Inst Nacl Ciencia & Tecnol Bioanalit, BR-13083970 Sao Paulo - Brazil

• Tipo de documento: Artigo Científico
• Fonte: SCIENTIFIC REPORTS; v. 5, AUG 21 2015.
• Citações Web of Science: 16

Resumo

A new protocol for fabrication of glass microchips is addressed in this research paper. Initially, the method involves the use of an uncured SU-8 intermediate to seal two glass slides irreversibly as in conventional adhesive bonding-based approaches. Subsequently, an additional step removes the adhesive layer from the channels. This step relies on a selective development to remove the SU-8 only inside the microchannel, generating glass-like surface properties as demonstrated by specific tests. Named sacrificial adhesive layer (SAB), the protocol meets the requirements of an ideal microfabrication technique such as throughput, relatively low cost, feasibility for ultra largescale integration (ULSI), and high adhesion strength, supporting pressures on the order of 5 MPa. Furthermore, SAB eliminates the use of high temperature, pressure, or potential, enabling the deposition of thin films for electrical or electrochemical experiments. Finally, the SAB protocol is an improvement on SU-8-based bondings described in the literature. Aspects such as substrate/resist adherence, formation of bubbles, and thermal stress were effectively solved by using simple and inexpensive alternatives. (AU)

• Processo FAPESP: 10/08559-9 - Sistemas microfluídicos eletroquímicos ultrassensíveis
• Beneficiário: Renato Sousa Lima
• Modalidade de apoio: Bolsas no Brasil - Doutorado