Cooling thermal parameters, microstructural spacing and mechanical properties in a directionally solidified hypereutectic Al-Si alloy

Autor(es)

Reyes, Rodrigo V. ^[1] ; Kakitani, Rafael ^[2] ; Costa, Thiago A. ^[2] ; Spinelli, Jose E. ^[1] ; Cheung, Noe ^[2] ; Garcia, Amauri ^[2]

Afiliação do(s) autor(es)

^[1] Fed Univ Sao Carlos UFSCar, Dept Mat Engn, Sao Carlos, SP - Brazil

^[2] Univ Estadual Campinas, Dept Mfg & Mat Engn, UNICAMP, Campinas, SP - Brazil

• Tipo de documento: Artigo Científico
• Fonte: PHILOSOPHICAL MAGAZINE LETTERS; v. 96, n. 6, p. 228-237, 2016.
• Citações Web of Science: 8

Resumo

Transient directional solidification experiments have been carried out with an Al-15wt. %Si alloy under cooling rates (http://www.w3.org/1999/xlink{''} xlink:href={''}tphl\_a\_1192297\_ilm0001.gif{''}) from 0.2 to 54K/s. A mixture of globular and fibre-like Si particles within the eutectic is shown to occur for cooling rates (http://www.w3.org/1999/xlink{''} xlink:href={''}tphl\_a\_1192297\_ilm0002.gif{''})>9K/s. The presence of refined globular Si particles arranging the microstructure either as primary particles or within the eutectic mixture seems to contribute for a combination of high tensile strength (sigma(u)) and elongation (). It is shown by correlations between eutectic () and secondary dendrite ((2)) spacings and sigma(u) and , given by Hall-Petch type formulae that the tensile properties increase significantly with the decrease in these spacings. However, it is shown that for higher ranges of spacings, i.e.: (-1/2)<0.65 and (-1/2)(2)<0.18, both tensile strength and elongation remain unaltered. (AU)

• Processo FAPESP: 15/11863-5 - Parâmetros da microestrutura de solidificação de ligas multicomponentes Al-Si-Cu, Sn-Bi-Sb e Zn-Sn-Cu e propriedades mecânicas decorrentes
• Beneficiário: José Eduardo Spinelli
• Modalidade de apoio: Auxílio à Pesquisa - Regular
• Processo FAPESP: 14/50502-5 - Interrelation of thermal and microstructural solidification parameters and corrosion/tribocorrosion behavior of alloys for tribological, biomedical and solder applications
• Beneficiário: Amauri Garcia
• Modalidade de apoio: Auxílio à Pesquisa - Regular