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(Reference retrieved automatically from Web of Science through information on FAPESP grant and its corresponding number as mentioned in the publication by the authors.)

Cooling thermal parameters, microstructural spacing and mechanical properties in a directionally solidified hypereutectic Al-Si alloy

Full text
Author(s):
Reyes, Rodrigo V. [1] ; Kakitani, Rafael [2] ; Costa, Thiago A. [2] ; Spinelli, Jose E. [1] ; Cheung, Noe [2] ; Garcia, Amauri [2]
Total Authors: 6
Affiliation:
[1] Fed Univ Sao Carlos UFSCar, Dept Mat Engn, Sao Carlos, SP - Brazil
[2] Univ Estadual Campinas, Dept Mfg & Mat Engn, UNICAMP, Campinas, SP - Brazil
Total Affiliations: 2
Document type: Journal article
Source: PHILOSOPHICAL MAGAZINE LETTERS; v. 96, n. 6, p. 228-237, 2016.
Web of Science Citations: 8
Abstract

Transient directional solidification experiments have been carried out with an Al-15wt. %Si alloy under cooling rates (http://www.w3.org/1999/xlink{''} xlink:href={''}tphl\_a\_1192297\_ilm0001.gif{''}) from 0.2 to 54K/s. A mixture of globular and fibre-like Si particles within the eutectic is shown to occur for cooling rates (http://www.w3.org/1999/xlink{''} xlink:href={''}tphl\_a\_1192297\_ilm0002.gif{''})>9K/s. The presence of refined globular Si particles arranging the microstructure either as primary particles or within the eutectic mixture seems to contribute for a combination of high tensile strength (sigma(u)) and elongation (). It is shown by correlations between eutectic () and secondary dendrite ((2)) spacings and sigma(u) and , given by Hall-Petch type formulae that the tensile properties increase significantly with the decrease in these spacings. However, it is shown that for higher ranges of spacings, i.e.: (-1/2)<0.65 and (-1/2)(2)<0.18, both tensile strength and elongation remain unaltered. (AU)

FAPESP's process: 15/11863-5 - Microstructure evaluation of ternary Al-Si-Cu, Sn-Bi-Sb and Zn-Sn-Cu and its correlations with mechanical properties
Grantee:José Eduardo Spinelli
Support Opportunities: Regular Research Grants
FAPESP's process: 14/50502-5 - Interrelation of thermal and microstructural solidification parameters and corrosion/tribocorrosion behavior of alloys for tribological, biomedical and solder applications
Grantee:Amauri Garcia
Support Opportunities: Regular Research Grants