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(Referência obtida automaticamente do Web of Science, por meio da informação sobre o financiamento pela FAPESP e o número do processo correspondente, incluída na publicação pelos autores.)

A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys

Texto completo
Autor(es):
Dias, Marcelino [1] ; Costa, Thiago A. [2] ; Silva, Bismarck L. [3] ; Spinelli, Jose E. [4] ; Cheung, Noe [1] ; Garcia, Amauri [1]
Número total de Autores: 6
Afiliação do(s) autor(es):
[1] Univ Estadual Campinas, UNICAMP, Dept Mfg & Mat Engn, BR-13083860 Campinas, SP - Brazil
[2] Fed Inst Educ Sci & Technol Para, IFPA, BR-66093020 Belem, Para - Brazil
[3] Univ Fed Rio Grande do Norte, UFRN, Dept Mat Engn, BR-59078970 Natal, RN - Brazil
[4] Fed Univ Sao Carlos UFSCar, Dept Mat Engn, BR-13565905 Sao Carlos, SP - Brazil
Número total de Afiliações: 4
Tipo de documento: Artigo Científico
Fonte: MICROELECTRONICS RELIABILITY; v. 81, p. 150-158, FEB 2018.
Citações Web of Science: 8
Resumo

Sn-Sb alloys are among the current alternatives for the development of alloys for high -temperature lead-free solders. The Sn-Sb alloys having 5.5 wt.% Sb or less are known to have good mechanical properties, and despite the quite low liquidus temperature have been considered adequate in the development of solder joints. The increase in the Sb content up to the limit of solubility in Sn at about 10 wt.% is supposed to be detrimental to the mechanical properties due to the extensive formation of an intermetallic compound. Investigations on the interrelation of microstructure of this alloy and the corresponding mechanical properties are fundamental to an appropriate evaluation of its application in solder joints. The present investigation analyses the relationship between microstructural features of the peritectic Sn-10 wt.% Sb alloy, solidified under a wide range of cooling rates, and the resulting mechanical properties. A cellular beta-Sn matrix, typified by cellular spacings that decrease with the increase in the solidification cooling rate, and Sn3Sb2 particles are shown to characterize the alloy microstructure. The ultimate tensile strength is higher as compared with the corresponding values of the hypoperitectic Sn-5.5 wt.% Sb solder alloy, however the elongation is shown to decrease. A comparison with Bi-Ag alloys, considered good high temperature solders alternatives, has shown that the tensile properties of the Sn10 wt.% Sb alloy, including elongation, are significantly higher. Wettability tests have been carried out and the experimental results, according to reports from the literature, are associated with good wettability. (AU)

Processo FAPESP: 16/18186-1 - Evolução microestrutural e resistências mecânica e ao desgaste de ligas ternárias Al-Bi-Si e Al-Bi-Ni solidificadas unidirecionalmente
Beneficiário:José Marcelino da Silva Dias Filho
Linha de fomento: Bolsas no Brasil - Pós-Doutorado
Processo FAPESP: 17/15158-0 - Caracterização microestrutural e de propriedades na avaliação de ligas para contato térmico interfacial
Beneficiário:Amauri Garcia
Linha de fomento: Auxílio à Pesquisa - Regular
Processo FAPESP: 13/09267-0 - Evolução microestrutural na solidificação transitória de ligas monofásicas e peritéticas Sn-Sb (e Sn-Sb-X) para soldagem e em camadas interfaciais solda/substrato
Beneficiário:José Marcelino da Silva Dias Filho
Linha de fomento: Bolsas no Brasil - Doutorado