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(Reference retrieved automatically from Web of Science through information on FAPESP grant and its corresponding number as mentioned in the publication by the authors.)

A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys

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Author(s):
Dias, Marcelino [1] ; Costa, Thiago A. [2] ; Silva, Bismarck L. [3] ; Spinelli, Jose E. [4] ; Cheung, Noe [1] ; Garcia, Amauri [1]
Total Authors: 6
Affiliation:
[1] Univ Estadual Campinas, UNICAMP, Dept Mfg & Mat Engn, BR-13083860 Campinas, SP - Brazil
[2] Fed Inst Educ Sci & Technol Para, IFPA, BR-66093020 Belem, Para - Brazil
[3] Univ Fed Rio Grande do Norte, UFRN, Dept Mat Engn, BR-59078970 Natal, RN - Brazil
[4] Fed Univ Sao Carlos UFSCar, Dept Mat Engn, BR-13565905 Sao Carlos, SP - Brazil
Total Affiliations: 4
Document type: Journal article
Source: MICROELECTRONICS RELIABILITY; v. 81, p. 150-158, FEB 2018.
Web of Science Citations: 8
Abstract

Sn-Sb alloys are among the current alternatives for the development of alloys for high -temperature lead-free solders. The Sn-Sb alloys having 5.5 wt.% Sb or less are known to have good mechanical properties, and despite the quite low liquidus temperature have been considered adequate in the development of solder joints. The increase in the Sb content up to the limit of solubility in Sn at about 10 wt.% is supposed to be detrimental to the mechanical properties due to the extensive formation of an intermetallic compound. Investigations on the interrelation of microstructure of this alloy and the corresponding mechanical properties are fundamental to an appropriate evaluation of its application in solder joints. The present investigation analyses the relationship between microstructural features of the peritectic Sn-10 wt.% Sb alloy, solidified under a wide range of cooling rates, and the resulting mechanical properties. A cellular beta-Sn matrix, typified by cellular spacings that decrease with the increase in the solidification cooling rate, and Sn3Sb2 particles are shown to characterize the alloy microstructure. The ultimate tensile strength is higher as compared with the corresponding values of the hypoperitectic Sn-5.5 wt.% Sb solder alloy, however the elongation is shown to decrease. A comparison with Bi-Ag alloys, considered good high temperature solders alternatives, has shown that the tensile properties of the Sn10 wt.% Sb alloy, including elongation, are significantly higher. Wettability tests have been carried out and the experimental results, according to reports from the literature, are associated with good wettability. (AU)

FAPESP's process: 17/15158-0 - Characterization of microstructure and properties in the evaluation of alloys for thermal interface contact
Grantee:Amauri Garcia
Support Opportunities: Regular Research Grants
FAPESP's process: 13/09267-0 - Microstructural evolution in the transient solidification of monophasic and peritectic Sn-Sb solder alloys (and Sn-Sb-X) and in solder/substrate interfacial layers
Grantee:José Marcelino da Silva Dias Filho
Support Opportunities: Scholarships in Brazil - Doctorate
FAPESP's process: 16/18186-1 - Microstructural evolution and mechanical and wear resistances of ternary Al-Bi-Si and Al-Bi-Ni alloys unidirectionally solidified
Grantee:José Marcelino da Silva Dias Filho
Support Opportunities: Scholarships in Brazil - Post-Doctoral