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(Referência obtida automaticamente do Web of Science, por meio da informação sobre o financiamento pela FAPESP e o número do processo correspondente, incluída na publicação pelos autores.)

SiOxCyHz-TiO2 Nanocomposite Films Prepared by a Novel PECVD-Sputtering Process

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Autor(es):
Gomes Oliveira, Lucas Pires [1] ; Ribeiro, Rafael Parra [1] ; Ribeiro Bortoleto, Jose Roberto [1] ; Cruz, Nilson Cristino [1] ; Rangel, Elidiane Cipriano [1]
Número total de Autores: 5
Afiliação do(s) autor(es):
[1] Univ Estadual Paulista UNESP, Inst Ciencia & Tecnol Sorocaba ICTS, Lab Plasmas Tecnol LaPTec, Av Tres Marco 511, BR-18087180 Sorocaba, SP - Brazil
Número total de Afiliações: 1
Tipo de documento: Artigo Científico
Fonte: MATERIALS RESEARCH-IBERO-AMERICAN JOURNAL OF MATERIALS; v. 24, n. 1 2021.
Citações Web of Science: 0
Resumo

Recently, there has been growing interest in the incorporation of particles in plasma deposited thin films to creation of multifunctional surfaces. In this work a new hybrid methodology based on the plasma enhanced chemical vapor deposition (PECVD) of hexamethyldisiloxane combined to the reactive sputtering of TiO2 is proposed for the preparation of SiOxCyHz-TiO2 composite films. Specifically, the effect of the proportion of O-2 in the plasma environment on the morphology, chemical structure, elemental composition, wettability, thickness and surface roughness, of the films was studied. Agglomerates of TiO2 (16-83 mu m) were detected into the organosilicon matrix with the concentration of particulates growing with the percentage of oxygen in the feed. In general, there was elevation in the angle of contact of the surfaces as the oxygen supply increased. Interpretation is proposed in terms of the influence of the oxygen supply on the TiO2 sputtering rate and in the oxidation of plasma species. (AU)

Processo FAPESP: 17/21034-1 - Filmes Nanocompósitos Multifuncionais SiO2 -TiO2 e SiO2-TiO2/CeO2 Depositados por Metodologia Híbrida de Plasma
Beneficiário:Elidiane Cipriano Rangel da Cruz
Modalidade de apoio: Auxílio à Pesquisa - Regular