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(Referência obtida automaticamente do Web of Science, por meio da informação sobre o financiamento pela FAPESP e o número do processo correspondente, incluída na publicação pelos autores.)

Microstructural characterization of Cu-Sn-Zn electrodeposits produced potentiostatically from acid baths based on trisodium nitrilotriacetic

Texto completo
Autor(es):
de Carvalho, Marcos F. [1] ; Carlos, Ivani A. [1]
Número total de Autores: 2
Afiliação do(s) autor(es):
[1] Univ Fed Sao Carlos, Chem Dept, CP 676, BR-13565905 Sao Carlos, SP - Brazil
Número total de Afiliações: 1
Tipo de documento: Artigo Científico
Fonte: JOURNAL OF ELECTROANALYTICAL CHEMISTRY; v. 823, p. 737-746, AUG 15 2018.
Citações Web of Science: 1
Resumo

This study characterizes the Cu-Sn-Zn electrodeposits produced potentiostatically from baths containing different concentrations of Cu2+, Sn2+ and Zn2+ ions and 0.60 M trisodium nitrilotriacetic (NTA) at pH 4.99 (higher stability). Ternary electrodeposits were produced onto AISI 1010 steel substrate at electrodeposition potential of -1.60 V with electrodeposition charge density of 3.0 Ccm(-2). Chemical composition of electrodeposits varied significantly, presenting higher Cu content (at.%) than that of other elements. Furthermore, it was verified that the high concentration of Sn2+ ions in the baths hindered the reduction of Zn2+ ions, leading to Zn-poor electrodeposits. Microstructure was generally composed of irregular crystallites and clusters of crystallites or dendrites dispersed on the surface, depending on chemical composition. X-ray diffraction showed formation of the ternary alloy by mixture of the Cu5Zn8, eta-Cu6Sn5 and Sn pure phases. In addition, electrodeposits with lower Cu content (at.%) also showed the SnO phase. Surface topography of the electrodeposits presented a rough aspect, with arithmetic roughness varying from 1.83 to 3.90 mu m for electrodeposits with lower and higher Sn content (at.%), respectively. Adhesion tests indicated that the highest and lowest adherence percentages to the steel substrate were observed for the electrodeposits with the largest Zn and Sn contents (at.%), respectively. (AU)

Processo FAPESP: 08/57652-1 - Estudos eletroanalíticos do processo de eletrodeposição da liga Cu-Sn obtida a partir de banho não cianetado: caracterização morfológica, química e estrutural dos eletrodepósitos
Beneficiário:Ivani Aparecida Carlos
Linha de fomento: Auxílio à Pesquisa - Regular
Processo FAPESP: 09/53487-9 - Desenvolvimento e caracterizacao de um banho nao-cianetado para a eletrodeposicao de ligas de cu/zn/sn. caracterizacao dos filmes de cu/zn/sn.
Beneficiário:Marcos Fernandes de Carvalho
Linha de fomento: Bolsas no Brasil - Doutorado