Autor(es)

Martorano, K. M. ^[1] ; Martorano, M. A. ^[1] ; Brandi, S. D. ^[1]

Afiliação do(s) autor(es)

^[1] Univ Sao Paulo, Dept Met & Mat Engn, BR-05508900 Sao Paulo - Brazil

• Tipo de documento: Artigo Científico
• Fonte: Journal of Materials Processing Technology; v. 209, n. 6, p. 3089-3095, MAR 19 2009.
• Citações Web of Science: 9

Resumo

Wetting balance tests of copper sheets submerged in tin solder baths were carried out in a completely automatic wetting balance. Wetting curves were examined for three different values of sheet thickness and four different solder bath temperatures. Most of the wetting curves showed a distorted shape relative to that of a standard curve, preventing calculation of important wetting parameters, such as the wetting rate and the wetting force. The wetting tests showed that the distortion increased for a thicker sheet thickness and a lower solder bath temperature, being the result of solder bath solidification around the submerged sheet substrate. (C) 2008 Elsevier B.V. All rights reserved. (AU)

• Processo FAPESP: 96/04242-1 - Galvanização a quente: estudo do molhamento de zinco e suas ligas sobre o aço
• Beneficiário: Katia Marques
• Modalidade de apoio: Bolsas no Brasil - Doutorado
• Processo FAPESP: 03/08576-7 - Modelagem matematica da solidificacao de ligas binarias sob efeito de conveccao natural no liquido e movimentacao da fase solida.
• Beneficiário: Marcelo de Aquino Martorano
• Modalidade de apoio: Auxílio à Pesquisa - Jovens Pesquisadores