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(Reference retrieved automatically from Web of Science through information on FAPESP grant and its corresponding number as mentioned in the publication by the authors.)

Optimal conditions for the wetting balance test

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Author(s):
Martorano, K. M. [1] ; Martorano, M. A. [1] ; Brandi, S. D. [1]
Total Authors: 3
Affiliation:
[1] Univ Sao Paulo, Dept Met & Mat Engn, BR-05508900 Sao Paulo - Brazil
Total Affiliations: 1
Document type: Journal article
Source: Journal of Materials Processing Technology; v. 209, n. 6, p. 3089-3095, MAR 19 2009.
Web of Science Citations: 9
Abstract

Wetting balance tests of copper sheets submerged in tin solder baths were carried out in a completely automatic wetting balance. Wetting curves were examined for three different values of sheet thickness and four different solder bath temperatures. Most of the wetting curves showed a distorted shape relative to that of a standard curve, preventing calculation of important wetting parameters, such as the wetting rate and the wetting force. The wetting tests showed that the distortion increased for a thicker sheet thickness and a lower solder bath temperature, being the result of solder bath solidification around the submerged sheet substrate. (C) 2008 Elsevier B.V. All rights reserved. (AU)