Electro-mechanical packaging of micro pressure sensors

• Grant number: 99/11439-4
• Support Opportunities: Research Grants - Innovative Research in Small Business - PIPE
• Start date: September 01, 2000
• End date: March 31, 2005
• Field of knowledge: Engineering - Electrical Engineering - Industrial Electronics, Electronic Systems and Controls
• Principal Investigator: Alfeu Fissore
• Grantee: Alfeu Fissore
• Company: Fissore Consultoria e Assessoria Técnico Científica S/C Ltda
• City: Campinas

Abstract

Pressure transducers based on silicon micro sensors are already a technological reality and constitute a true revolution for different industrial segments such as automotive, medical, biomedical, control, etc. The principal component of the transducers is the silicon micro pressure sensor, the design and manufacture of which depends on its application. It is impossible to develop various different types of micro pressure sensors in the medium term here in Brazil. The research activities of this project have been under development for close to five years and have reached a point in which the results obtained encourage their industrial exploration. The proposal is to design and develop miniaturized electromechanical packaging for the enclosure of silicon micro pressure sensors purchased abroad, in this way assembling the pressure transducers. The micro sensor will be assembled on a ceramic plate made using thick film technology. In principle, two types of exploratory prototypes will be developed, denominated Type A and Type B. Type A will make use of a pressure micro sensor made with ultra modern technology and, in this case, the user will have to supply the circuitry for the regulation of signal standard for its specific use. Type B is a throw-away transducers, the chip for which is also made with cutting edge technology, of high performance, especially designed to satisfy all existing requirements for medical instruments. The pressure sensor must be compensated and calibrated using laser trimming of thick film resistors. The transducer integrates a high performance chip tolerant to radiation, with thermal and calibration compensation circuitry, and a protective gel in a low cost capsule. (AU)