Grant number: | 18/16932-3 |
Support Opportunities: | Scholarships abroad - Research Internship - Master's degree |
Start date: | October 25, 2018 |
End date: | April 24, 2019 |
Field of knowledge: | Engineering - Materials and Metallurgical Engineering - Physical Metallurgy |
Principal Investigator: | Claudio Shyinti Kiminami |
Grantee: | Fernando Henrique Paes de Almeida |
Supervisor: | Michael Joseph Kaufman |
Host Institution: | Centro de Ciências Exatas e de Tecnologia (CCET). Universidade Federal de São Carlos (UFSCAR). São Carlos , SP, Brazil |
Institution abroad: | Colorado School of Mines, United States |
Associated to the scholarship: | 17/10042-3 - Microstructure of the Al-M-Ce (M = Ti, V, Cr) alloy system solidified under different cooling rates, BP.MS |
Abstract Aluminum alloys have been increasingly studied because they are light alloys, have a great versatility of microstructures, and consequently, mechanical properties. Recent studies conducted in the Department of Materials Engineering - UFSCar, in partnership with the Colorado School of Mines (USA), presented that alloys of the Al-Mn-Ce system have a great versatility of mechanical properties associated with the presence of the Al20Mn2Ce phase. However, because it is a metastable phase, the maintenance of the mechanical properties at elevated temperatures for alloys of this system is not guaranteed. Thus, the research internship abroad project at Colorado School of Mines aims to evaluate the high temperature compression mechanical properties for alloys of Al- (V, Ti) -Ce systems using Gleeble 3500. The mechanical reinforcing phase Al20V2Ce is provided at equilibrium for Al-V-Ce system at the temperature of interest (400ºC). There is no evidence in the literature of ternary equilibrium diagram for the Al-Ti-Ce, but studies indicate the stability of the Al20Ti2Ce phase at 400ºC. In addition, no studies were found that show the mechanical properties at elevated temperatures for these two systems. (AU) | |
News published in Agência FAPESP Newsletter about the scholarship: | |
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