| Grant number: | 19/10885-6 |
| Support Opportunities: | Scholarships abroad - Research Internship - Master's degree |
| Start date: | August 01, 2019 |
| End date: | October 15, 2019 |
| Field of knowledge: | Engineering - Materials and Metallurgical Engineering - Nonmetallic Materials |
| Principal Investigator: | Daniel Souza Corrêa |
| Grantee: | Patrick Pires Conti |
| Supervisor: | Irene Goldthorpe |
| Host Institution: | Embrapa Instrumentação Agropecuária. Empresa Brasileira de Pesquisa Agropecuária (EMBRAPA). São Carlos , SP, Brazil |
| Institution abroad: | University of Waterloo, Canada |
| Associated to the scholarship: | 18/08012-1 - Development of nanostructured sensors based on ceramic materials and conducting polymers aiming the monitoring of volatile organic compounds, BP.MS |
Abstract Volatile Organic Compounds (VOCs) can cause several environmental and human health risks. In this context, chemical sensors have been proposed as a suitable alternative to monitor VOCs, due to sensitivity, selectivity and portability characteristics. The use of flexible electrodes as substrates for chemical sensors based on composites (conductive / ceramic polymers) provides additional advantages to these types of devices, allowing the manufacture of lower cost sensors operating at room temperature. This project aims at the development of sensors based on flexible substrates, produced with different materials, modified by ceramic nanomaterials (0D and 1D) and conductive polymers. The 1D ceramic nanomaterial will be obtained through the electrospinning process and the 0D through chemical synthesis route. To analyze the performance of nanocomposites on flexible platforms, different solution deposition techniques will be tested. After preparing the platforms, they will be characterized by physical-chemical, morphological and electrical methods. Parameters such as limit of detection, selectivity and sensitivity will be investigated towards volatile organic compounds. | |
| News published in Agência FAPESP Newsletter about the scholarship: | |
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