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Ricardo Henrique Dias

CV Lattes ORCID


Universidade de São Paulo (USP). Escola de Engenharia de São Carlos (EESC)  (Institutional affiliation from the last research proposal)
Birthplace: Brazil

He has experience in the area of #8203;#8203;Electrical Engineering, with a focus on electronics. He is currently a FAPESP fellow in the area of #8203;#8203;software development in additive manufacturing. (Source: Lattes Curriculum)

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