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Low f-number microlens array fabricated in thick resist

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Author(s):
Cirino, Giuseppe A. ; Montagnoli, Arlindo N. ; Verdonck, Patrick ; Neto, Luiz G. ; Thienpont, H ; Mohr, J ; Zappe, H ; Nakajima, H
Total Authors: 8
Document type: Journal article
Source: MICRO-OPTICS 2012; v. 8428, p. 9-pg., 2012-01-01.
Abstract

In certain applications of MOEMS devices, it is often necessary to produce microlens array structures that concentrate optical power in semiconductor photodetectors. In this work, the design and fabrication of a low f-number cylindrical microlens array is presented. The lenses were fabricated in thick photo resist - 12 mu m thick - using a contact printer exposure through a mask with a repetitive 6 mu m line - 4 mu m space pattern. The width of the resulting microlens array was determined to be 10 mu m, with f-number of 0.5. Numerical calculations based on scalar diffraction theory were employed to model the light propagation inside the resist, determining the aerial image as a function of its thickness. Than the resist response characteristics, expressed by its contrast curve, and absorption rate were used to obtain a cross section profile. A good match between numerical and experimental results were found. (AU)

FAPESP's process: 08/57858-9 - National Institute for Optics and Photonics
Grantee:Vanderlei Salvador Bagnato
Support Opportunities: Research Projects - Thematic Grants