5th inter technical symp packaging assembling testing & exhibition | campinas - sp

• Grant number: 03/04366-8
• Support Opportunities: Organization Grants - Organization of Scientific Meeting
• Start date: August 06, 2003
• End date: August 08, 2003
• Field of knowledge: Engineering - Electrical Engineering
• Principal Investigator: Carlos Alberto dos Reis Filho
• Grantee: Carlos Alberto dos Reis Filho
• Host Institution: Faculdade de Engenharia Elétrica e de Computação (FEEC). Universidade Estadual de Campinas (UNICAMP). Campinas , SP, Brazil
• Event type: Simpósio
• Promoting institution: International Microeletronics and Packaging Society. IMAPS/Brasil
• Geographic coverage: Internacional