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Smart packaging - I am here

Grant number: 17/08126-4
Support type:Research Grants - Innovative Research in Small Business - PIPE
Duration: March 01, 2018 - February 29, 2020
Field of knowledge:Physical Sciences and Mathematics - Computer Science
Principal Investigator:Helio Avelino da Silva
Grantee:Helio Avelino da Silva
Company:Reciclapac Soluções para Embalagens Ltda
CNAE: Desenvolvimento e licenciamento de programas de computador customizáveis
Outras atividades de prestação de serviços de informação não especificadas anteriormente
City: São Paulo
Assoc. researchers:Antonio Luiz Frare Perez
Associated scholarship(s):19/10905-7 - Smart packing - i AM here, BP.TT
18/21795-5 - Smart packing: I am here, BP.TT
18/18731-5 - Smart packing: I am here, BP.TT
+ associated scholarships 18/03090-4 - Smart packing: I am here, BP.TT
18/02164-4 - Smart packing: I am here, BP.TT
18/01924-5 - Smart packing: I am here, BP.PIPE - associated scholarships

Abstract

The automotive industry uses racks and returnable packaging to transport components into its supply chain. Considering the number of car models, thousands of suppliers and huge amount of racks used, this management is extremely complex, generating production line stops, losses of assets, extra costs, among others. In Fapesp and I-Corps training Program, approximately 100 professionals from the automotive sector were interviewed and reported the management of the returnable packaging as the biggest challenge faced by Logistics and Packaging areas. The clarity that current management technologies do not offer an effective solution motivated this project in partnership with SENAI and GM Brazil as a model case. We propose contributions to solve this management problem by focusing on steel racks to transport complex parts and / or high value, with the development of management software, integrated to beacons, using Internet technology of Things (IoT - Internet of Things) for the emission of radiofrequency signals, which allow the exchange of data consuming low energy, to control these assets by IoT, in the fields of transportation and logistics. This proposal converges to concepts of Industry 4.0, as the term encompasses technologies for automation and data exchange, through the concepts of cyber-physical systems, IoT, and cloud computing. Cyber-physical systems monitor physical processes, create a virtual copy of the physical world, and make decentralized decisions. With IoT, cyber-physical systems communicate and cooperate with each other and with humans in real-time, and by cloud computing, services are made available and accessed by members of the chain, allowing the collected data to be used, within the concept of Big Data defined in Barton (2012) as a basis for management and decision making, opening possibilities of gains, especially in Brazil. According to research (CNI-Indicators, 2016), the use of technologies involving Industry 4.0 are poorly disseminated and used. Only 58% of companies are aware of their importance to competitiveness and less than half use them, which increases the prospects for gains. Thus we set the following objectives: research and develop new processes, adopting the concepts of Industry 4.0, so that the racks communicate with the members of the chain, giving real-time visibility of the location and flow of the packages, the flow of products, besides the Collection of reliable data in real time, usable as an intelligence tool in logistics management. The intention is to integrate it to other systems of the organizations in the value chain by API (Application Programming Interface), generating benefits in the management. The methodology will include the analysis of the company's current processes, identification of parameters and business rules for optimization, identification and testing of innovative IoT technologies, which are effective and low cost, to allow the design of processes integrated to the management solution. (AU)

Articles published in Agência FAPESP Newsletter about the research grant
Smart packaging cuts cost for manufacturers 
Articles published in Pesquisa para Inovação FAPESP about research grant:
Smart packaging cuts cost for manufacturers 
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