Advanced search
Start date
Betweenand

PRODUCTION OF LEAD FREE NANOCOMPOSITE SOLDER BY MECHANICAL ALLOYING

Grant number: 12/10800-1
Support type:Scholarships in Brazil - Scientific Initiation
Effective date (Start): August 01, 2012
Effective date (End): July 31, 2013
Field of knowledge:Engineering - Materials and Metallurgical Engineering
Principal Investigator:Marcelo Falcão de Oliveira
Grantee:Joaquim Manoel Justino Netto
Home Institution: Escola de Engenharia de São Carlos (EESC). Universidade de São Paulo (USP). São Carlos , SP, Brazil

Abstract

Solders play a fundamental role as jointing materials in electronics industry: they must guarantee electrical, thermal and mechanical continuity between the conected components. The performance and quality of a solder are essential to the welded joints integrity, which is crucial to the good operation of the assembly as a whole. For long time, alloys of the system Sn-Pb have been used in soldering. However, concerns about lead, which is inherently toxic, led to the prohibition of its usage in electronic artifacts in USA, Japan and countries of European Union. The need of developing lead-free solders with good properties in general thus emerged. In his work, Babaghorbani developed a method based on Powder Metalurgy techniques, using a microwave syntering route, to produce a new solders generation of the system Sn-Ag. According to his results, good properties have been obtained with the incorporation of Cu and SnO2 nanoparticles as reinforcements in the Sn-Ag matrix. In this work, Mechanical Alloying will be used as alternative to the Powder Metalurgy techniques, which need syntering and imply in higher costs, to obtain a composite solder with nanoparticulated cooper reinforcements.