| Grant number: | 16/07160-1 |
| Support Opportunities: | Scholarships in Brazil - Scientific Initiation |
| Start date: | June 01, 2016 |
| End date: | July 31, 2017 |
| Field of knowledge: | Engineering - Materials and Metallurgical Engineering - Physical Metallurgy |
| Principal Investigator: | Luiz Tadeu Fernandes Eleno |
| Grantee: | Thiago Trevizam Dorini |
| Host Institution: | Escola de Engenharia de Lorena (EEL). Universidade de São Paulo (USP). Lorena , SP, Brazil |
Abstract Electronic circuits are usually manufactured using Cu, Ni, Ag, and Au-based alloys, while the consumable material for the weld are lead-based alloys. In this regard, however, there is a growing concern with the levels of lead found in materials for various applications, between them the welding of electronic components, due to the high toxicity of lead, that, from direct contact or contamination of natural resources, can cause serious damage to human health. For this reason, there is an increasing interest in lead-free solder alloys and the search for new materials for this application. Between the possible candidates, the most promising alloys are, among others, Sn-Ag, Sn-Cu, and Sn-In. The local microstructure of the heat-affected zone (HAZ) of the post-weld material will be, in this way, a mixture of intermetallic phases of a multicomponent system, resulting from the combination of elements in the substrate and the consumable. One of the key systems for the HAZ study involving lead-free solders is the binary Ni-In. The present proposal has as its main goal the update of the thermodynamic description of the Ni-In (nickel-indium) binary system using experimental and ab initio data from the literature, following models of the Compound Energy Formalism (CEF) within the scope of the CALPHAD method. As a result, we will compile a thermodynamic database with the description of the Ni-In phase diagram , which should serve as a basis for the description of multicomponent systems. | |
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