Scholarship 17/15808-4 - Transmissão de energia elétrica, Simulação por computador - BV FAPESP
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Numerical modeling of Litz wire bundles allowing for skin and proximity effects for the computer simulation of transcutaneous energy transfer devices

Grant number: 17/15808-4
Support Opportunities:Scholarships in Brazil - Scientific Initiation
Start date: November 01, 2017
End date: October 31, 2018
Field of knowledge:Engineering - Electrical Engineering - Electrical, Magnetic and Electronic Circuits
Principal Investigator:Viviane Cristine Silva
Grantee:Gustavo Domingues Carvalho
Host Institution: Escola Politécnica (EP). Universidade de São Paulo (USP). São Paulo , SP, Brazil
Associated research grant:13/24434-0 - Electromagnetic propeller systems for implantable artificial heart and mechanical circulatory support devices, AP.TEM

Abstract

Litz wires are commonly used in Transcutaneous Wireless Energy Transmission (TET) systems for charging batteries of implantable devices in the human body, such as artificial organs. Its purpose is to reduce losses due to the skin and proximity effects that are present in the operation of these devices. As the TET system coil is to be implanted in the human body, accurate prediction of these losses is a crucial step in its design and analysis. Therefore, the Finite Element Method, in two and three dimensions, will be used to evaluate the performance of the most commonly used TET configurations. Due to the difficulty in modeling the Litz conductors (which are formed by bundles of hundreds of copper wires, whose diameters measure a few microns) special models, such as the homogenization technique, will be investigated and tested. As the TET system coil is to be implanted in the human body, accurate prediction of these losses is a crucial step in its design and analysis. Therefore, the Finite Element Method, in two and three dimensions, will be used to evaluate the performance of the most commonly used TET configurations. Due to the difficulty in modeling the litz wires (which are formed by bundles of hundreds of copper wires, whose diameters measure a few microns) special models, such as the homogenization technique, will be investigated and tested. (AU)

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