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Interoperability in the application layer in cyber-physical systems

Grant number: 18/23052-0
Support Opportunities:Scholarships in Brazil - Master
Start date: November 01, 2018
End date: October 31, 2019
Field of knowledge:Engineering - Electrical Engineering
Principal Investigator:Anarosa Alves Franco Brandão
Grantee:Douglas Lima Dantas
Host Institution: Escola Politécnica (EP). Universidade de São Paulo (USP). São Paulo , SP, Brazil
Associated research grant:17/50343-2 - Institutional development plan in the area of digital transformation: advanced manufacturing and smart and sustainable cities (PDIp), AP.PDIP

Abstract

The Internet of Things (IoT) is a constantly growing field. In it, complex projects use a lot of different components, such as sensors, actuators, connectivity elements, cloud computing technologies, among others. This need has given rise to the IoT platforms, which are solutions that abstract the complexity from the point of view of the software developer. However, the application developer must deal not only with communication between physical components but also between systems and humans. The purpose of this work is to define an interoperability layer in the application layers of a set of platforms so that an interface is available that allows the creation of multiplatform solutions. (AU)

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Academic Publications
(References retrieved automatically from State of São Paulo Research Institutions)
DANTAS, Douglas Lima. SToIC: portability and interoperability in application layer of IoT platforms.. 2020. Master's Dissertation - Universidade de São Paulo (USP). Escola Politécnica (EP/BC) São Paulo.