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| Author(s): |
Taís Leite Ferreira Pinto
Total Authors: 1
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| Document type: | Master's Dissertation |
| Press: | Piracicaba. |
| Institution: | Universidade de São Paulo (USP). Escola Superior de Agricultura Luiz de Queiroz (ESALA/BC) |
| Defense date: | 2007-02-02 |
| Examining board members: |
Silvio Moure Cicero;
Jose de Barros França Neto;
Julio Marcos Filho
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| Advisor: | Silvio Moure Cicero |
| Abstract | |
Image analysis is a very promising technique to determine damages in seeds, which can result in losses of germination and vigor. This precise method examines seeds individually by using enlarged images in which damaged areas, as well their exact location and extension, can be found and examined in details. This is a non-destructive method, so analyzed seeds can be submitted to physiological tests to establish the relationship between damage and quality loss. The goal of this research was to study the use of image analysis technique (X-ray) to identify chinch-bugs, mechanical and humidity damages in soybean seeds. The research was carried out at Image Analysis and Seed Analysis Laboratories from Crop Science Department, “Luiz de Queiroz” College of Agriculture, University of São Paulo, in Piracicaba, SP, Brazil. Seeds of different lots of soybean, cultivar BRS 184, were submitted to the X-ray test and, consecutively, used for the first count of the germination test, in order to determine the possible relationship between cause and effect. Simultaneously, X-ray test was compared with the tetrazolium test. For the interpretation of the X-ray test, the severity and location of chinch-bugs, mechanical and humidity damages were considered. The results showed that X-ray test is efficient to detect these damages in soybean seeds. (AU) | |