Melissa Mederos Vidal

Graduated in bachelor of Physics from the University of Havana, with a Master's degree in Materials Science and Technology from the Institute of Materials Science and Technology at the University of Havana, a PhD in Nanoscience and Advanced Materials from the Federal University of ABC (UFABC) and post-doctorates from FEEC- Unicamp, developed at CCSNano and by the Renato Archer Information Technology Center in the Assembly, Packaging and Systems Integration Division, and in the Nano, Microsystems and Materials Division. It has experience in the areas of solid state physics, semiconductor physics and condensed matter physics, with research into photovoltaic cells based on ultrathin layers of group II-VI semiconductors and thermoelectric phenomena with Seebeck effect and Peltier effect cells, based in manganese and cobalt perovskites doped with rare earths (lanthanum and Samarium). Extensive knowledge in the area of micro/nanoelectronics and semiconductor components with an emphasis on structural, electrical and transport properties in MOS structures containing Ge and SiGe nanoparticles for applications in discrete floating gate non-volatile memory devices, Memristors and MOS technology; in the area of electronic packaging within the context of development and characterization of deposited layers of thin films for application in MCM-D devices (Multichip Modules), and in the area of photonics in prototyping activities for photonic devices and manufacturing photonic microchips using the platform of LiNbO3 thin films on silica, in which it is possible to prepare and manipulate quantum states of light to be used in quantum information protocols. It has extensive experience in deposition techniques (LPCVD, ECR-CVD, PECVD, Sputtering, electrolytic deposition, chemical deposition, etc.) and characterization (SEM, Raman, XDR, AFM, ellipsometry, 4-point, profilometry, etc.) both of thin films and nanostructures. Also in the area of microfabrication of electronic and photonic devices, with extensive knowledge of lithography including the operation of the MJB3 and MicroWriter ML3 photoaligners (Maskless/direct writing) and electron beam lithography using a SEM-FEG Mira 3 XMU Electron Microscope Tescan and o Raith e-Line, lift-off and corrosion manufacturing processes (wet and plasma), layout developments with CleWin, Klayout and DrawBeam software (SEM-FEG Mira 3 XMU Tescan), use of photoresists, BCB, PMMA, maN, and SU8 for both brightfield and darkfield lithography, as well as the use of different types of substrates (Silicon, SOI, Alumina, Glass, SiC, etc.) and general cleanroom activities. Likewise, he has extensive experience in the teaching field. (Source: Lattes Curriculum)