Advanced search
Start date
Betweenand
Related content
(Reference retrieved automatically from SciELO through information on FAPESP grant and its corresponding number as mentioned in the publication by the authors.)

Electrochemical behavior of carbon steel pre-treated with an organo functional bis-silane filled with copper phthalocyanine

Full text
Author(s):
Patricia H. Suegama [1] ; Idalina V. Aoki [2]
Total Authors: 2
Affiliation:
[1] Universidade de São Paulo. Escola Politécnica. Departamento de Engenharia Química - Brasil
[2] Universidade de São Paulo. Escola Politécnica. Departamento de Engenharia Química - Brasil
Total Affiliations: 2
Document type: Journal article
Source: Journal of the Brazilian Chemical Society; v. 19, n. 4, p. 744-754, 2008-00-00.
Abstract

The bis-[trimethoxysilylpropyl]amine (BTSPA) film filled with copper phthalocyanine (Cu-Ph) was prepared by adding different concentrations of copper phthalocyanine - Cu-Ph and deposited on a carbon steel substrate using 120 ºC and 150 ºC as curing temperatures. For samples cured at 150 ºC a second layer was also deposited. The electrochemical behavior of carbon steel coated with BTSPA filled with Cu-Ph was studied by electrochemical measurements, electrochemical impedance spectroscopy (EIS) and polarization curves, in aerated 0.1 mol L-1 NaCl solution. Physical and chemical characterization was made by thermogravimetric analysis (TGA), scanning electron microscopy, contact angle measurements and infrared spectroscopy. TGA showed no decomposition of Cu-Ph during the curing process. Cu-Ph added into the silane film showed a strong influence on its corrosion resistance, mainly when the samples are cured at 150 ºC. The results showed that lower inhibitor concentrations led to a higher corrosion resistance and the second layer increased by one order of magnitude the corrosion resistance. (AU)