Innovative Vertical Coupling Photonic Packaging Using Additive Technology

Author(s)

Finardi, Celio Antonio ; Biazoli, Claudecir Ricardo ; Cyrino Mattar, Jose Eduardo ; Hernandez-Figueroa, Hugo E. ; Panepucci, Roberto Ricardo

• Document type: Journal article
• Source: 2024 SBFOTON INTERNATIONAL OPTICS AND PHOTONICS CONFERENCE, SBFOTON IOPC 2024; v. N/A, p. 3-pg., 2024-01-01.

Abstract

Coupling light to and from optical fibers is a challenge for silicon photonic due to size differences and mechanical complexity. This paper addresses the development of packaging for vertical (off-plane) coupling using 3D printing. We demonstrated that additive technology can be used to manufacture fiber arrays and vertical coupling packaging platforms, simplifying photonic packaging and enabling rapid and cost-effective customization and prototyping. Results of 250 mu m resin fiber arrays are presented, describing the groove fabrication, fiber array assembly and their dimensional/optical characterization. Silicon photonic IC packaging is also shown, and evolution of these developments is mentioned. (AU)

• FAPESP's process: 21/11380-5 - CPTEn - São Paulo Center for the Study of Energy Transition
• Grantee: Luiz Carlos Pereira da Silva
• Support Opportunities: Research Grants - Science Centers for Development