The proposed research project involves the processing of radar absorbing materials, named also as RAM, using a conducting composite based on magnetic substrates impregnated, in situ, with the poly(o-methoxyabiline - POMA)conducting polymer. This study aims to contribute technical and scientifically in processing area of thinner and lighter microwave absorbers. Besides this, this project intends to contribute with the Institute of Science and Technology (ICT) of UNIFESP, São José dos Campos, nucleating the area related to both the obtaining of microwave absorbing centers and RAM processing. In this way, the implementation of this project proposal at ICT/UNIFESP will disseminate the knowledge acquired to date by the researcher during this studies at the Technological Institute of Aeronautics and the Institute of Aeronautics and Space (IAE), starting in the host institution this area of research and development, which has proved very promising due to the possible studies to be conducted. Initial studies were carried out with the support of FAPESP, in the master and doctoral levels, obtaining conducting composites based on POMA impregnated in carbon black and carbon nanotubes substrates. Very promising results have been obtained with microwave attenuation values greater than 99%. However, the challenge of making thinner absorbers motivated the proposition of this project. Accordingly, the proposed project aims to expand the studies in this area, obtaining hybrid composite conductors by combining magnetic substrates (ferrites and carbonyl iron) and POMA, which polymer is characterized by dielectric behavior. It is noteworthy that, in the literature consulted no similar studies were found using POMA. Thus, besides the novelty of this proposal, the implementation of this work will strengthen the research group of ICT/UNIFESP and also will contribute to the formation of the researcher who will have the opportunity to expand their knowledge with a new research team.
News published in Agência FAPESP Newsletter about the scholarship: