Due to the current advances in the development of electronic devices, with the highesttechnology, these equipment are becoming smaller and need effective thermalmanagement to not affect their performance, useful life, and confidence. The creation ofmultifunctional nanocomposite materials has attracted great technological and scientificinterest due to its ability to combine properties in a single material. Thus, materials thatcombine properties such as lightness, thermal conductivity and mechanical resistanceare of great interest and can be attractive in this field, in addition to having goodprospects in the technological sector. Graphene is recognized as the most promisingthermally conductive material for the manufacture of high-performance nanocompositeswith high thermal conductivity. The synergistic effect of combining graphene withhexagonal boron nitride (h-BN) can bring even higher thermal properties. Thus, thisproject aims to produce hybrid nanocomposites of acrylonitrile butadiene styrenecopolymer (ABS) with two-dimensional materials graphene/h-BN. The nanocompositeswill be obtained by melt mixing using an extruder. To meet the need for gooddispersion and adhesion with the matrix, graphene oxide (GO) will also be produced.The 2D materials will be characterized by X-ray Diffraction (XRD), RamanSpectroscopy, Atomic Force Microscopy (AFM), Scanning (SEM) and Transmission(TEM) Electron Microscopy. The main characterization of nanocomposites will be thethermal conductivity, specific to the application in which the final material is intended.In addition, the materials will also be characterized by electrical and mechanicalbehavior, to verify whether the addition of the two-dimensional materials will alsocause positive properties changes. The actuality of the proposed theme is not only in theuse of graphene, but also in the possibility of obtaining hybrid nanocomposites thathave high thermal, electrical and mechanical performance. In this context, thepossibility of obtaining a hybrid composite can bring unique properties with effectivethermal management for heat dissipation in electronic devices. In addition, this projecthas the collaboration of other renowned researchers, national and international,specialized in the subject matter and who support and cooperate with the successfuldevelopment of this project.
News published in Agência FAPESP Newsletter about the scholarship: