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Development of graphene and MWCNT hybrid nanocomposites-based on PC/ABS blends for electronic components housing

Grant number: 19/11130-9
Support type:Scholarships in Brazil - Master
Effective date (Start): August 01, 2019
Effective date (End): March 31, 2021
Field of knowledge:Engineering - Materials and Metallurgical Engineering - Nonmetallic Materials
Principal Investigator:Fabio Roberto Passador
Grantee:Erick Gabriel Ribeiro dos Anjos
Home Institution: Instituto de Ciência e Tecnologia (ICT). Universidade Federal de São Paulo (UNIFESP). Campus São José dos Campos. São José dos Campos , SP, Brazil


Development of polymeric material for electronic industrial applications is a challenge; however, it also has huge strategic importance for the growth of that sector in Brazil. The increasingly industrial of electronic devices needs for materials more competitive which have high performance is ascendant. The most important requirements include lightness, easily conformation and electromagnetic shielding (EMI SE). Polycarbonate (PC) is largely applied in the electronics industry nonetheless this material has limitations like: low impact strength and electrical insulation. One way to increase the impact strength of PC is the mixture with acrylonitrile butadiene styrene copolymer (ABS). In addition, aiming application in electronic components housting, this project proposes the addition of two conductive fillers, nanoplates of graphene (GNP) and carbon nanotubes (CNT), in a polymeric insulator matrix to obtain a hybrid nanocomposite with EMI SE protection. Both fillers are allotropes of carbon with extraordinary electrical and mechanical properties. Then, the addition of these fillers into a polymeric matrix can result in improvements on electrical conductivity, elastic modulus, tensile strength, thermal stability, and UV resistance. This study is searching to understand the processability and compatibility of these components using techniques, methods and blend equipment. The viability for use that new material will be based on electrical, mechanical, thermal and EMI SE properties. (AU)