Effect of ohmic heating on the properties of flexible packaging materials

• Grant number: 22/09587-3
• Support Opportunities: Scholarships abroad - Research Internship - Post-doctor
• Start date: May 01, 2023
• End date: April 30, 2024
• Field of knowledge: Agronomical Sciences - Food Science and Technology - Food Technology
• Principal Investigator: Marisa Padula
• Grantee: Luís Marangoni Júnior
• Supervisor: Antonio Augusto Vicente
• Host Institution: Instituto de Tecnologia de Alimentos (ITAL). Agência Paulista de Tecnologia dos Agronegócios (APTA). Secretaria de Agricultura e Abastecimento (São Paulo - Estado). Campinas , SP, Brazil
• Institution abroad: Universidade do Minho (UMinho), Portugal
• Associated to the scholarship: 21/04043-2 - Food-packaging-process interaction: effect of emerging processing technologies and different food simulants on packaging properties, BP.PD

Abstract

Emerging food processing technologies are increasingly present in the scientific and industrial environment. Emphasizing ohmic heating, which is constantly growing as a method of food preservation with minimal loss of quality when compared to conventional thermal processes. This technology is bringing a new paradigm to thermal food processing, reducing excessive thermal load (it does not depend on the heat transport mechanisms by conduction and convection) and benefiting from the non-thermal effects of electric fields. Ohmic processing can be applied in different food systems, particulate or not, which can lead to an increase in the quality of the final product. Ohmic heating has numerous applications including blanching, evaporation, dehydration, fermentation, extraction, sterilization and heating of foods. To minimize the risk of post-process contamination and avoid expensive aseptic packaging lines, packaging prior to ohmic heating treatment should be considered. The concept of ohmic packaged food processing includes placing a filled package in the center of an ohmic chamber surrounded by a conductive medium through which an electrical current flows through two electrodes. Therefore, studying the effect of ohmic heating on the properties of packaging materials is vital to ensure proper processing, as well as subsequent transport, storage and distribution steps. Therefore, the objective of this research is to evaluate the effect of ohmic heating on the properties of potential packaging materials that may be used to package foods that will be processed by ohmic heating. Therefore, the present project proposes a Research Internship Abroad (BEPE) as an interesting complement to the activities already carried out in Brazil and an opportunity to study another emerging food and processing technology, in addition to contributing to the internationalization of research carried out in the State of Sao Paulo. (AU)