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Development of a novel high entropy alloy by mechanical alloying

Grant number: 23/15812-2
Support Opportunities:Scholarships abroad - Research Internship - Doctorate
Start date: April 01, 2024
End date: June 30, 2024
Field of knowledge:Engineering - Materials and Metallurgical Engineering - Physical Metallurgy
Principal Investigator:Diego Rafael Nespeque Correa
Grantee:Jhuliene Elen Muro Torrento
Supervisor: Sophia Alexandra Tsipas
Host Institution: Faculdade de Ciências (FC). Universidade Estadual Paulista (UNESP). Campus de Bauru. Bauru , SP, Brazil
Institution abroad: Universidad Carlos Iii De Madrid, Campus De Leganés, Spain  
Associated to the scholarship:21/13921-3 - Development of a low cost high entropy alloy for potential use as bone fixation devices, BP.DR

Abstract

Recently, high entropy alloys (HEAs) composed of five or more elements in a proportion close to equimolar have been developed. These materials have been recognized for their high mechanical strength, elasticity, and corrosion resistance, which have attracted attention in the biomedical field. However, the currently developed high entropy alloys need adjusted mechanical, electrochemical, and biological properties for use as biomaterials. This makes the development of new HEA alloys for use specifically as biomaterials a promising field. In addition, mechanical alloying is one of the most efficient and sustainable methods to prepare HEAs because it can enhance solid solubility and produce homogeneous microstructures from powder particles. In this scenery, this project aims to develop the recently developed high entropy alloy Ti-30Zr-28Nb-5Mn-1.5Al-5Fe (wt.%) through mechanical alloying of raw metallic powders and compare to the sample produced by argon arc-melting in terms of density, phase composition, microstructure, and selected mechanical properties. Then, the potential biomedical application of the mechanically alloyed sample in contrast to the cast one will be evaluated.

News published in Agência FAPESP Newsletter about the scholarship:
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