| Full text | |
| Author(s): |
Total Authors: 2
|
| Affiliation: | [1] Univ Estadual Campinas, Sch Elect & Comp Engn, Dept Commun, BR-13083852 Campinas, SP - Brazil
Total Affiliations: 1
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| Document type: | Journal article |
| Source: | Journal of Lightwave Technology; v. 35, n. 24, p. 5440-5447, DEC 15 2017. |
| Web of Science Citations: | 1 |
| Abstract | |
Low-loss optical interconnects in hybrid integrated platforms for silicon photonics are likely to become increasingly important to overcome power consumption limitations in telecom packaging applications. Here, we show a short taper device that effectively interconnects electro-optic polymer modulators waveguides and silicon-on-insulator platforms without altering the polymer modulator fabrication process. We achieved power transmission better than -0.2 dB with very good alignment shift tolerance over the whole C-band, by using tapers as short as 179.5 mu m. (AU) | |
| FAPESP's process: | 08/57857-2 - Photonics for optical communications |
| Grantee: | Hugo Luis Fragnito |
| Support Opportunities: | Research Projects - Thematic Grants |