| Full text | |
| Author(s): |
Cirino, G. A.
;
Barea, L. A. M.
;
Mansano, R. D.
;
Verdonck, P.
;
von Zuben, A.
;
Frateschi, N. C.
;
Diniz, J. A.
;
VonFreymann, G
;
Schoenfeld, WV
;
Rumpf, RC
Total Authors: 10
|
| Document type: | Journal article |
| Source: | ADVANCED FABRICATION TECHNOLOGIES FOR MICRO/NANO OPTICS AND PHOTONICS XII; v. 10930, p. 5-pg., 2019-01-01. |
| Abstract | |
In this work we present a comparative study of two processes for the fabrication of an array of microchannels for microfluidics applications, based on integrated-circuit technology process steps, such as lithography and dry etching. Two different methods were investigated in order to study the resulting microstructures: wet and dry deep etching of silicon substrate. The typical etching depth necessary to the target application is 50 mu m. (AU) | |
| FAPESP's process: | 16/09509-1 - Phase change heat transfer processes of high performance applied to solar energy recovery |
| Grantee: | Gherhardt Ribatski |
| Support Opportunities: | Research Projects - Thematic Grants |