Photonics IC Packaging Investigation based on 3D Printing Approach

Author(s)

Finardi, Celio Antonio ; Biazoli, Claudecir Ricardo ; Cyrino Mattar, Jose Eduardo ; Hernandez-Figueroa, Hugo E. ; Panepucci, Roberto Ricardo

• Document type: Journal article
• Source: 2024 LATIN AMERICAN WORKSHOP ON OPTICAL FIBER SENSORS, LAWOFS 2024; v. N/A, p. 2-pg., 2024-01-01.

Abstract

Optical packaging optimization is a crucial factor, constituting a large part of the total development of optical solutions. This paper addresses an investigation aimed at increasing the flexibility, cost-effectiveness, and customization potential of packaging methods. By employing 3D-printing techniques, this work focuses on designing an optical packaging architecture, including fiber coupling and interconnected resin parts. The presented results of single fiber edge coupling demonstrate the viability of the technology, with the potential to meet demands for communication and sensing applications. Future developments are also mentioned. (AU)

• FAPESP's process: 21/11380-5 - CPTEn - São Paulo Center for the Study of Energy Transition
• Grantee: Luiz Carlos Pereira da Silva
• Support Opportunities: Research Grants - Science Centers for Development