| Full text | |
| Author(s): |
Rosario, A. V.
[1]
;
Santos, M. C.
[2]
;
Mascaro, L. H.
[1]
;
Bulhoes, L. O. S.
[3]
;
Pereira, E. C.
[1]
Total Authors: 5
|
| Affiliation: | [1] Univ Fed Sao Carlos, Lab Interdisciplinar Eletroquim & Ceram, Ctr Multidisciplinar Desenvolvimento Mat Ceram, Dept Quim, BR-13565905 Sao Carlos, SP - Brazil
[2] Univ Fed Abc, CCNH, LEMN, BR-09210170 Santo Andre, SP - Brazil
[3] Ctr Univ Cent Paulista UNICEP, CENIP, BR-13563470 Sao Carlos, SP - Brazil
Total Affiliations: 3
|
| Document type: | Journal article |
| Source: | Thin Solid Films; v. 518, n. 10, p. 2669-2673, MAR 1 2010. |
| Web of Science Citations: | 4 |
| Abstract | |
In this work, the electrogravimetric behavior of copper electrodeposition on TiO(2) electrodes was analyzed. Copper electrodeposition was carried out in 0.1 mol L(-1) H(2)SO(4) using several concentrations of CuSO(4). The voltammetric curve displays a redox processes. The first redox process occurs in the region of -0.30 at 0.1 V (vs. saturated calomel electrode, SCE) and it is related to bulk Cu electrodeposition and stripping. For this cathodic process, it was observed that the mass gain increases both as the sweep rate decreases and as the concentration of copper increases. The second redox process, which occurs between -0.1 V and 0.35 V (vs. SCE), the stripping charge (and mass) are independent of both sweep rate and CuSO(4) concentration and, finally, there is a saturation charge (and saturation mass) as the deposition time is increased. From the saturated mass, obtained using an electrochemical quartz crystal nanobalance, for this electrodeposition process (248 ng cm(-2)) a roughness factor of 1.8 was calculated for the TiO(2) film. (C) 2009 Elsevier B.V. All rights reserved. (AU) | |