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(Reference retrieved automatically from Web of Science through information on FAPESP grant and its corresponding number as mentioned in the publication by the authors.)

Microstructure and mechanical properties of Sn-Bi, Sn-Ag and Sn-Zn lead-free solder alloys

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Author(s):
Osorio, Wislei R. [1, 2] ; Peixoto, Leandro C. [2] ; Garcia, Leonardo R. [2] ; Mangelinck-Noel, Nathalie [3, 4] ; Garcia, Amauri [2]
Total Authors: 5
Affiliation:
[1] Univ Estadual Campinas, UNICAMP, Sch Appl Sci FCA, BR-13484350 Limeira, SP - Brazil
[2] Univ Estadual Campinas, UNICAMP, Dept Mat Engn, BR-13083970 Campinas, SP - Brazil
[3] Univ Aix Marseille, Lab Mat & Microelect Prov, Fac Sci Case 142, Marseille - France
[4] Univ Sud Toulon Var, Lab Mat & Microelect Prov, Fac Sci Case 142, Marseille - France
Total Affiliations: 4
Document type: Journal article
Source: Journal of Alloys and Compounds; v. 572, p. 97-106, SEP 25 2013.
Web of Science Citations: 94
Abstract

The aim of this paper is to develop a comparative evaluation of mechanical properties of as-cast Sn-Bi, Sn-Ag and Sn-Zn alloys as a function of the resulting microstructural arrays with a view to application as solder materials. The resulting microstructures, ultimate and yield tensile strengths and elongations of Sn-40 wt.% Bi, Sn-3.5 wt.% Ag and Sn-9 wt.% Zn alloys were examined and compared with the corresponding results of the traditional Sn-40 wt.% Pb solder alloy. Tensile tests were carried out using specimens selected from specific positions along the length of the directionally solidified castings and Hall-Petch type correlations have been proposed relating the resulting tensile properties of each alloy to a parametric scale of the microstructure. It was found that all Pb-free alloys examined comply with a compromise between compatible mechanical strength and environmental protection. The Sn-Bi alloy has the highest ultimate tensile strength of all alloys examined, while both Sn-Ag and Sn-Zn alloys are lighter and exhibited higher ductility than the Sn-Pb and Sn-Bi alloys. (C) 2013 Elsevier B.V. All rights reserved. (AU)