3D integration at millimeter wave

• Grant number: 22/13645-9
• Support Opportunities: Regular Research Grants
• Start date: July 01, 2023
• End date: June 30, 2025
• Field of knowledge: Engineering - Electrical Engineering - Telecommunications
• Principal Investigator: Gustavo Pamplona Rehder
• Grantee: Gustavo Pamplona Rehder
• Host Institution: Escola Politécnica (EP). Universidade de São Paulo (USP). São Paulo , SP, Brazil
• Associated researchers: Ariana Maria da Conceicao Lacorte Caniato Serrano ; Rafael Abrantes Penchel

Abstract

In the millimeter-wave (mmW) frequency range several unlicensed frequency bands are being selected for point-to-point high-bandwidth communication links. These multi-gigabit links will be crucial for the infrastructure of the emerging RF, mmW and THz consumer applications serving the markets of high-speed telecommunications systems (next generations of mobile communication, 6G and beyond), 77GHz/120GHz automotive radars, mmW Imaging and high sensitivity radar sensors. In this context, this project proposes the development a 3D interconnects to integrate different technologies at millimeter wave on an interposer. The proposed interposer is based on a revolutionary low cost MnM (metallic nanowires membrane) substrate with inherent slow-wave effect. This new technology is based on dielectric nanoporous membranes filled with metallic nanowires obtained through simple fabrication processes, even at frequencies as high as 100 GHz, where the critical dimensions of the circuits are limited even by the most advanced commercial technologies (like CMOS) making their design unrealizable. The 3D integration technology will be fully developed at the Microelectronics Laboratory of the Polytechnic School of São Paulo University (LME-EPUSP) using conventional microelectronic processes and low cost readily available materials. This original project is supported by the French laboratory TIMA with whom the proponent of this project shares the invention and patent of the MnM interposer. (AU)