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High performance and lowcost MnM devices for millimeter-wave applications from 30 to 110 GHz


The emerging market for telecommunications in millimeter wave (mmW) from 30 GHz to 300 GHz has impelled a great interest worldwide for the development of high performance and low cost transceivers for consumer applications. In view of this, this project proposes the development of miniaturized 3D interconnects, high-density capacitors and passive devices for applications in millimeter wave with high performance. These circuits will be integrated on the same substrate, forming a novel interposer at mmW. The proposed interposer is based on a revolutionary low cost MnM (metallic nanowires membrane) substrate with inherent slow-wave effect. This new technology is based on dielectric nanoporous membranes filled with metallic nanowires obtained through simple fabrication processes, even at frequencies as high as 100 GHz, where the critical dimensions of the circuits are limited even by the most advanced commercial technologies (like CMOS) making their design unrealizable. The MnM interposer and all the devices proposed, such as transmission lines, filters, couplers, power splitters, high density capacitors will be fully developed at the Microelectronics Laboratory of the Polytechnic School of São Paulo University (LME-EPUSP) using conventional microelectronic processes and low cost readily available materials. This original project is supported by the French laboratory IMEP-LAHC, since the proponent of this project is one of the conceivers of the innovative concept and co-inventor of the two international patents with the French laboratory, one on the MnM substrate already deposited, and the other on the MnM interposer in progress. (AU)

Articles published in Pesquisa FAPESP Magazine about the research grant:
5G technology made in Brazil 
Una tecnología 5G <em>made in Brazil</em> 
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Scientific publications
(References retrieved automatically from Web of Science and SciELO through information on FAPESP grants and their corresponding numbers as mentioned in the publications by the authors)
SERRANO, A. L. C.; PINHEIRO, J. M.; JEONG, S.; GOMES, L. G.; ALVARENGA, R. C. A.; FERRARI, P.; REHDER, G. P.; IEEE. 3D Inductors with Nanowire Through Substrate Vias. 2017 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM (IMS), v. N/A, p. 4-pg., . (11/18167-3, 12/15159-2)
PINHEIRO, JULIO M.; REHDER, GUSTAVO P.; GOMES, LEONARDO G.; ALVARENGA, ROGERIO C. A.; PELEGRINI, MARCUS V.; PODEVIN, FLORENCE; FERRARI, PHILIPPE; SERRANO, ARIANA L. C.. 110-GHz Through-Substrate-Via Transition Based on Copper Nanowires in Alumina Membrane. IEEE Transactions on Microwave Theory and Techniques, v. 66, n. 2, p. 784-790, . (11/18167-3, 12/15159-2)
BOVADILLA, R. G.; MOLITOR, O. D.; SERRANO, A. L. C.; REHDER, G. P.; IEEE. Optimization of RF MEMS Phase Shifter for microwaves applications. 2017 32ND SYMPOSIUM ON MICROELECTRONICS TECHNOLOGY AND DEVICES (SBMICRO): CHIP ON THE SANDS, v. N/A, p. 4-pg., . (11/18167-3, 12/15159-2)

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