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EMU: Acquisition of a Flip-Chip System for 3D Integration in Millimeter-Wave Waves.

Abstract

The project "EMU: Acquisition of Flip-Chip System for 3D Integration in Millimeter Waves," led by researcher Gustavo Pamplona Rehder from the Polytechnic School of the University of São Paulo (Poli-USP), aims to advance research and development in next-generation wireless communications, particularly in the millimeter-wave (mmW) frequency range.Gustavo Rehder highlights his experience in managing multi-user equipment, including laser lithography, laser cutting, and millimeter-wave characterization. He emphasizes the significance of the proposed equipment, such as the Flip-Chip Bonder (Manual Placer System - MPS) and the Upgrade of VNA N5227B, to propel research in advanced devices.The Flip-Chip Bonder is essential for chip soldering and bonding, fluid application, and precise alignment, while the Upgrade of VNA N5227B targets the characterization of devices in the D-band (110 GHz to 170 GHz) for applications in the future sixth generation (6G) of mobile internet.The project aims not only to anticipate the challenges of 6G but also to position Brazil at the forefront of global research. The technology under development includes the MnM interposer, showing promise for applications above 110 GHz, international collaborations, and 3D integration with STM chips, contributing to technological innovation in the wireless communications landscape. The project is not only geared towards academic research but also towards collaboration with the national industry, establishing the foundation for an innovative and collaborative ecosystem. (AU)

Articles published in Agência FAPESP Newsletter about the research grant:
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